BMI SYSTEMS
High-performance duroplasts with thermally curable groups can be used to manufacture compound materials, prepregs, laminates, and grinding discs.
After thermal curing, these duroplastic resin systems show excellent thermo-oxidative and mechanical properties.
Homide 250
CAS-No. 26140-67-0
Homide 250
Homide 250 is a prepolymer bismaleimide resin system with a low softening range of 90-125°C supplied in powder form. The resin can be cured thermally to create a cross-linked thermoset with excellent thermal and mechanical resistance. Homide 250 can be processed in powder form or dissolved in an organic solvent, such as dimethylformamide or N-methylpyrrolidone, up to a concentration of 45% for the production of composite materials.
Applications:
Advantages:
- Prepregs and laminates for the electronic industry
- Thin laminates and prepregs for multiplayer printed circuit boards
- Resin bond diamond wheels and tools
- Heavy-duty insulating for electrical applications
- High-temperature applications
- Glass, aramide and carbon fibre-reinforced composites
- Aircraft, spacecraft and military applications
- Dimensional stability
- Excellent properties in fire
- Excellent chemical resistance
- Excellent mechanical properties even after prolonged ageing at 250°C
- Homide 250 is soluble in DMF and NMP
- Homide 250 is dispersible in water
| Product name | Homide 250 |
| Appearance | yellow powder |
| Melting point / Softening range (DSC) | 90-125 °C |
| Gel time (Hot plate at 171 °C) | 150-400 sec |
Close
Homide 400L
Homide 400L
Homide 400L is a duroplastic resin system offered in the form of a 60 – 70% solution in methylethylketone. Due to the pre-set viscosity and the resin content, this resin solution is suitable for impregnating glass fabric and fibre glass. Homide 400L is a single-component resin system. After thermal curing, this product becomes a finished polymer with a high glass temperature and outstanding long-term stability, as well as good mechanical and electrical properties. Thermal curing can be accelerated by adding catalysts such as 2-phenylimidazole.
Properties:
Applications:
- Exact concentration with defined resin content for impregnating processes.
- Soluble in organic solvents with a low boiling point, such as acetone and methylethylketone, at room temperature
- The 60 – 70% resin solution can be diluted with acetone
- Curing at a temperature of 200-250°C
- DDM-free resin system
- The resin solution remains stable during storage at room temperature for several months.
- PCBs
- Prepregs and laminates
- Copper-clad laminates
- Coatings
| Product name | Homide 400L |
| Appearance | viscous brown resin solution |
| Melting point / Softening range (DSC) | – |
| Gel time (Hot plate at 171 °C) | > 50 min |
Close
Homide 400
Homide 400
Homide 400 is a duroplastic resin system which has been produced on basis of a BMI formulation. The resin is supplied in form of a resolidified melt. Homide 400 is a one-component resin system which is free from solvents or aromatic amines like for example DDM.
Properties:
- Fusible at a temperature >80°C
- DDM and solvent-free
- Long-term thermal stability up to 270°C
Applications:
- RTM
- Pultrusion
- Hot-melt prepregs
| Product name | Homide 400 |
| Appearance | resolidified brown melt |
| Melting point / Softening range (DSC) | < 80 °C |
| Gel time (Hot plate at 171 °C) | > 10 min |
Close
Homide 801 / 801L
Homide 801/Homide 801L
Homide 801 is a thermoset resin system. It is an A-stage prepolymer of our bismaleimide monomers. This resin system already contains components guaranteeing excellent resilience and inter-laminar bonding following post-curing. Homide 801L is a ready-to-use resin solution for the impregnation of glass fabric, carbon and aramide fibre with a resin concentration of 60-70% in methyl ethyl ketone. This resin system offers the advantage that it can be used without additional additives and catalysts. The cured resin has outstanding mechanical properties, thermal stability and a high glass transition temperature.
Properties:
- Pre-set resin solution for impregnating processes
- Can be diluted with methyl ethyl ketone
- MDA- free
- Curing at a temperature of 200-220°C
- Storage stability at room temperature for six months
Applications:
- PCBs
- Prepregs and laminates
- Copper-clad laminates
- Composites
- Moulding parts
| Thermal properties | |
|
Glass transition temperature (Tg) DSC: DMA: TMA: |
241,33°C 342,9°C 280,6°C |
| Delamination Temperature by TMA: | 359,2°C |
|
Degradation Temperature (TGA). 2 % weight loss: 5 % weight loss: |
379,7°C 394,6°C |
Close
Homide 802 / 802L
Homide 802
Homide 802 is a thermoset resin system. It is an A-stage prepolymer of our bismaleimide monomers. This resin system already contains components guaranteeing excellent resilience and inter-laminar bonding following post-curing. Homide 802L is a ready-to-use resin solution for the impregnation of glass fabric, carbon and aramide fibre with a resin concentration of 60-70% in methyl ethyl ketone. This resin system offers the advantage that it can be used without additional additives and catalysts. The cured resin has outstanding mechanical properties, thermal stability and a high glass transition temperature.
Properties:
- Pre-set resin solution for impregnating processes
- Can be diluted with methyl ethyl ketone
- MDA- free
- Curing at a temperature of 200-220°C
- Storage stability at room temperature for six months
Applications:
- PCBs
- Prepregs and laminates
- Copper-clad laminates
- Composites
- Moulding parts
| Thermal properties | |
|
Glass transition temperature (Tg) DSC: DMA: TMA: |
241,33°C 342,9°C 280,6°C |
| Delamination Temperature by TMA: | 359,2°C |
|
Degradation Temperature (TGA). 2 % weight loss: 5 % weight loss: |
379,7°C 394,6°C |
Close
