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Page 1 of 2 High-performance duroplasts with thermally curable groups can be used to manufacture compound materials, prepregs, laminates, and grinding discs.
After thermal curing, these duroplastic resin systems show excellent thermo-oxidative and mechanical properties.
Homide 250
Homide 250 is a prepolymer bismaleimide resin system with a low softening range of 90-125°C supplied in powder form. The resin can be cured thermally to create a cross-linked thermoset with excellent thermal and mechanical resistance. Homide 250 can be processed in powder form or dissolved in an organic solvent, such as dimethylformamide or N-methylpyrrolidone, up to a concentration of 45% for the production of composite materials.
Homide 250
Bismaleimide resin
 Applications:
- Prepregs and laminates for the electronic industry
- Thin laminates and prepregs for multiplayer printed circuit boards
- Resin bond diamond wheels and tools
- Heavy-duty insulating for electrical applications
- High-temperature applications
- Glass, aramide and carbon fibre-reinforced composites
- Aircraft, spacecraft and military applications
Advantages:
- Dimensional stability
- Excellent properties in fire
- Excellent chemical resistance
- Excellent mechanical properties even after prolonged ageing at 250°C
- Homide 250 is soluble in DMF and NMP
- Homide 250 is dispersible in water
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